Surface Mount & Precision Printing
EMS SP 20/20 Stencil Printer
The foundation of our SMT line. This high-precision system ensures sub-micron accuracy in solder paste deposition, providing the perfect base for fine-pitch components and reducing the risk of bridge defects or "tombstoning."
Component Preparation & Preforming
To ensure a perfect mechanical fit and long-term solder joint reliability, we utilize automated preparation systems:
Axial Lead Cutter & Bender
Automates the shaping of through-hole components with repeatable precision, ensuring stress-free lead forming.
Vertical Preforming Station
Specialized shaping for high-density layouts, allowing components to be mounted vertically to optimize board real estate.
Digital Solder Pot
Controlled, high-purity tinning for wire leads and small-scale dip soldering, ensuring oxidation-free connections.
Precision Wire Stripping
High-accuracy stripping to maintain the integrity of internal conductors, essential for high-reliability aerospace and medical applications.
Rigorous ESD & Static Control
Quality is invisible. We protect your sensitive microelectronics from Electrostatic Discharge (ESD) through a multi-layered safety protocol:
Anti-static Aprons & Apparel
All technicians wear carbon-fiber-infused garments to neutralize static buildup.
Conductive Bead Belts
Continuous grounding for both personnel and mobile equipment to ensure a zero-volt potential across the production floor.
Why Our Equipment Matters to You
By combining automated lead forming with high-precision stencil printing and rigorous ESD controls, we deliver:
Lower Defect Rates
Automation removes the inconsistency of human error.
Faster Turnaround
High-speed cutters and printers accelerate the transition from prototype to production.
Long-Term Reliability
Our ESD and preforming protocols prevent "latent defects" that only appear after the product is in the field.